Modern production of electronic assemblies increasingly relies on miniaturization and growing component complexity. This change affects not only the components themselves, but also the assembly structures and soldering process parameters. As a result, the demands are rising not only for designers but also for teams responsible for quality control. Wherever traditional optical inspection methods fall short, X-ray imaging technology begins to play a key role, providing insight into the structure of solder joints without interfering with the PCB itself.
Limits of Optical Inspection and the Need for a Complete Picture
Experience shows that for components such as BGA, QFN, CSP, or LED, which do not have externally accessible leads, optical methods do not allow for a true assessment of connection quality. While AOI inspection works perfectly for detecting surface defects such as misalignments, bridges, or missing components, it is incapable of assessing what lies beneath the package. Meanwhile, many critical defects occur precisely in that area and may only become apparent after weeks or months of device operation.
In such cases, it is necessary to use technology capable of imaging through the package material while remaining sensitive to changes in the structure of solder joints. X-ray inspection meets these requirements, giving the engineer the ability to literally look inside the assembly – without damaging it, without destruction, while fully preserving the integrity of the component.
X-ray Imaging as a Tool for Process Engineering
X-ray inspection of assemblies is based on differences in radiation absorption by materials of varying densities. In practice, this means that solder, traces, pads, and other metallic structures appear as darker areas in the image, while voids, porosity, or cracks appear lighter. This imaging allows not only for the assessment of assembly correctness but also for the precise localization of defects: insufficient solder joints, cracks, asymmetries, cold solder joints, or flux residues.
X-ray inspection of assemblies is based on differences in radiation absorption by materials of varying densities. In practice, this means that solder, traces, pads, and other metallic structures appear as darker areas in the image, while voids, porosity, or cracks appear lighter. This imaging allows not only for the assessment of assembly correctness but also for the precise localization of defects: insufficient solder joints, cracks, asymmetries, cold solder joints, or flux residues.
Industrial Practice and Functionality of X-ray Systems
Modern X-ray systems dedicated to electronics are technologically advanced devices that combine high image resolution with 3D analysis capabilities. More and more often, they are integrated with software that supports not only the inspection process itself but also defect classification, report generation, and comparison of images with reference patterns. This enables analysis automation, reduces the impact of the human factor, and accelerates the decision-making process.
Modern X-ray systems dedicated to electronics are technologically advanced devices that combine high image resolution with 3D analysis capabilities. More and more often, they are integrated with software that supports not only the inspection process itself but also defect classification, report generation, and comparison of images with reference patterns. This enables analysis automation, reduces the impact of the human factor, and accelerates the decision-making process.
X-ray Inspection in the Offer of RENEX Group
RENEX Group offers two complementary approaches to X-ray testing. The first involves analysis of submitted samples at the Technical and Training Center. The client sends a PCB along with a description of the problem, and after the X-ray inspection is performed, receives a detailed report compliant with IPC standards. This type of service is usually completed within 1–2 business days. The second option is the implementation of an inspection station directly on the production line, enabling ongoing quality control, including first article inspection and immediate response to assembly process irregularities.
The offer includes inspection devices such as the SEC X-RAY 5100F – a system approved by the National Atomic Energy Agency, adapted for operation in an industrial environment. The purchasing and installation process has been optimized to ensure seamless integration of the equipment with the existing technological line. Obligations arising from radiological protection regulations are handled in accordance with PAA requirements, ensuring proper operator training and registration of each installation.
X-ray inspection offered by the RENEX Group is used in many industries, including the automotive, medical, aerospace, and space sectors. Services are provided to both domestic and international clients – including in R&D projects and prototype production, where high precision and documented joint quality are required. Practice also includes performing inspections for process validation and verification of assembly correctness in devices of critical operational importance.
The RENEX Group’s offer also includes full application and consulting support for the implementation and optimization of quality control processes. Within the Technology and Training Center and DEMOROOM space, solutions used in modern electronic and robotic production are presented. The scope of cooperation includes not only equipment delivery and data analysis but also training, technological consulting, and development of operational competencies at industrial recipients. Thanks to this, the RENEX Group is capable of carrying out comprehensive projects even in sectors with elevated regulatory and technological requirements.
